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preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 1 general description the az1117e is a low dropout three-terminal regulator with 1.0a output current ability, and the dropout voltage is specified at typical 1.1v at 1.0a current load, decreasing at lower load currents. the az1117e has been optimized for low voltage where transient response and minimum input voltage are critical. it provides current limit and thermal shutdown protection solutions. its circuit includes a trimmed band gap reference to assure output voltage accuracy to be within 1%. on-chip thermal shutdown provides protection against a combination of high current and ambient temperature that would create excessive junction temperature. the az1117e is available in 1.2v, 1.5v, 1.8v, 2.5v, 3.3v and 5.0v fixed output voltage versions and adj output voltage version. the fixed versions integrate the adjust resistors. the az1117e is available in the industry-standard to-252-2 (3) and sot-223 packages. features ? provide adj version (v ref =1.25v) and fixed voltage 1.2v, 1.5v, 1.8v, 2.5v, 3.3v and 5.0v with accuracy 1% (except 1.2v) ? current limit: 1.3a (typ.) ? dropout voltage: 1.1v (typ.) @i out =1a ? regulator stable with low esr mlcc ? excellent line regulation: 0.001%/v (typ.) @ i out =30ma ? excellent load regulation: 0.2%/a @i out =1a ? quiescent current: 3.5ma ? low output noise ? psrr: 70db ? otsd protection ? operation junction temperature: -40c to 125c applications ? tvs and lcd monitors ? pc peripherals: notebooks, motherboards ? stb figure 1. package types of az1117e sot-223 to-252-2 (3)
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 2 pin configuration d package h package (to-252-2 (3)) (sot-223) figure 2. pin configuration of az1117e (top view) pin descriptions pin number pin name function 1 adj/gnd adjustable pin or ground pin 2 output regulator output pin 3 input supply voltage pin 1 2 3 input output adj/gnd vout 1 2 3 input output adj/gnd vout
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 3 ordering information az1117e - circuit type package temperature range part number marking id packing type to-252-2 (3) -40 to 125 c az1117ed-1.2trg1 az1117ed-1.2g1 tape & reel az1117ed-1.5trg1 az1117ed-1.5g1 tape & reel az1117ed-1.8trg1 az1117ed-1.8g1 tape & reel az1117ed-2.5trg1 az1117ed-2.5g1 tape & reel az1117ed-3.3trg1 az1117ed-3.3g1 tape & reel az1117ed-5.0trg1 az1117ed-5.0g1 tape & reel az1117ed-adjtrg1 az1117ed-adjg1 tape & reel sot-223 -40 to 125 c az1117eh-1.2trg1 gh23f tape & reel az1117eh-1.5trg1 gh27f tape & reel az1117eh-1.8trg1 gh18g tape & reel az1117eh-2.5trg1 gh23g tape & reel az1117eh-3.3trg1 gh27g tape & reel az1117eh-5.0trg1 gh18h tape & reel az1117eh-adjtrg1 gh23h tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. 1.2: fixed output version 1.2v 1.5: fixed output version 1.5v 1.8: fixed output version 1.8v 2.5: fixed output version 2.5v 3.3: fixed output version 3.3v 5.0: fixed output version 5.0v adj: adjustable output g1: green tr: tape & reel packages d: to-252-2 (3) h: sot-223
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 4 absolute maximum ratings (note 1) parameter symbol value unit power supply voltage v in 16 v operating junction temperature range t j 150 oc storage temperature range t stg -65 to 150 oc lead temperature (soldering, 10sec) t lead 260 oc thermal resistance (junction to ambient) (note 2) ja sot-223 65 oc/w to-252-2 (3) 45 esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. note 2: chip is soldered to 200mm 2 (16mm*12.5mm) copper (top side solder mask) on 2oz.2 layers fr-4 pcb with 8*0.5mm vias. recommended operating conditions parameter symbol min max unit supply voltage v in 13 v operating junction temperature range t j -40 125 c
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 5 electrical characteristics v in =v out +1.5v, c in =1.0 f (ceramic), c out =1.0 f (ceramic), typical t a =25c, bold typeface applies over -40 c t j 125c ranges, unless otherwise specified. parameter symbol condition min typ max unit reference voltage v ref v out +1.5v v in 12v, i out =10ma 1.238 1.250 1.262 v 98%*v out v out 102%*v out v output voltage (fixed versions) v out for 1.2v, v out +1.5v v in 12v, i out =10ma 98%*v out v out 102%*v out v 96%*v out v out 104%*v out v for 1.5v to 5v, v out +1.5v v in 12v, i out =10ma 99%*v out v out 101%*v out v 98%*v out v out 102%*v out v dropout voltage v drop i out =1a 1.1 1.3 v maximum output current i out(max) 1.5v v in -v out 1 1.3 a load regulation v rload v in =v out +1.5v 1ma i out 1a 0.2 0.6 %/a line regulation v rline 1.5v v in -v out 10v, i out =30ma 0.001 0.04 %/v quiescent current i q for fixed voltage version, i out =0 3.5 6 ma minimum load current for adj version, 1.5v v in -v out 10v 2 5 ma adjustable pin current i adj 45 90 a adjustable pin current change 1.5v v in -v out 10v 0.2 5 a power supply rejection ratio psrr ripple 1.0 vp-p v in =v out +2v, i out =100ma f=120hz 70 db f=1khz 70 output voltage temperature coefficient t v / v out out i out =30ma 30 ppm/c rms output noise v noise 10hz f 100khz, no load 0.003 % thermal shutdown temperature t otsd 170 c thermal shutdown hysteresis t hyotsd 20 c thermal resistance (junction to case) jc sot-223 40 c/w to-252-2 (3) 24
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 6 typical performance characteristics figure 3. line regulation vs. temperature figure 4. load regulation vs. temperature figure 5. reference voltage vs. temperature figure 6. output voltage vs. temperature -40 -20 0 20 40 60 80 100 120 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 line regulation (mv) temperature ( o c) az1117e-3.3v v in =4.8v to 12v, i out =10ma continuous airflow 10scfm -40 -20 0 20 40 60 80 100 120 1.20 1.21 1.22 1.23 1.24 1.25 1.26 1.27 reference voltage (v) temperature ( o c) az1117e-adj v in =v out +1.5v, i out =10ma continuous airflow 10scfm -40 -20 0 20 40 60 80 100 120 -20 -15 -10 -5 0 5 10 15 20 load regulation (mv) temperature ( o c) az1117e-3.3v v in =5v i out =10ma to 500ma continuous airflow 10scfm -40 -20 0 20 40 60 80 100 120 3.10 3.15 3.20 3.25 3.30 3.35 3.40 output voltage (v) temperature ( o c) az1117e-3.3v v in =5v, i out =10ma continuous airflow 10scfm
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 7 typical performance characteristics (continued) figure 7. minimum load current vs. temperature figure 8. adjust pin current vs. temperature figure 9. dropout voltage vs. output current figure 10. dr opout voltage vs. temperature -40 -20 0 20 40 60 80 100 120 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 continuous airfow 10scfm dropout voltage (v) temperature ( o c) i out =10ma i out =100ma i out =500ma i out =800ma i out =1000ma -40 -20 0 20 40 60 80 100 120 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 minimum load current (ma) temperature ( o c) az1117e-adj v in =v out +1.5v continuous airflow 10scfm 0.00.20.40.60.81.0 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 dropout voltage (v) output current (a) t a =-40 o c t a =25 o c t a =85 o c continuous airflow 10scfm -40 -20 0 20 40 60 80 100 120 0 10 20 30 40 50 60 70 80 adjust pin current ( a) temperature ( o c) az1117e-adj v in =v out +1.5v continuous airflow 10scfm
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) figure 11. output voltage vs. output current figure 12. output voltage vs. output current figure 13. psrr vs. frequency figure 14. current limit vs. temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 output voltage (v) output current (a) az1117e-adj,t a =25 o c v in =2.5v v in =2.75v v in =3.0v v in =3.3v v in =4v v in =5v continuous airflow 10scfm package: sot-223 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 output voltage (v) output current (a) az1117e-adj, v in =2.75v package: sot-223 t a =-40 o c t a =25 o c t a =85 o c continuous airflow 10scfm 10 100 1k 10k 100k 0 10 20 30 40 50 60 70 80 90 100 psrr (db) frequency (hz) az1117e-adj c in =1.0 f, c out =1.0 f v in =v out +2v dc , ripple=1.0v p_p i out =5ma i out =100ma -40 -20 0 20 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 current limit (a) temperature ( o c) az1117e-adj v in =v out +1.5v continuous airflow 10scfm
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 9 typical performance characteristics (continued) figure 15. load transient response (az1117e-adj, v in =5v, v out =3.3v, c in =1.0f, c out =1.0f) v in 2v/div v out 50mv/div i out 500ma/div time 100 s/div
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 10 typical application az1117e-adj input output adj v in 1.0 f r1 330 r2 v out v in =5.0v 3.3v v out =v ref *(1+r2/r1)+i adj *r2 330 1.0 f 1.0 f 1.0 f gnd input az1117e-3.3 output figure 16. typical application of az1117e
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 11 mechanical dimensions sot-223 unit: mm(inch)
preliminary datasheet 1.0a low dropout linear regulator az1117e mar. 2013 rev 1. 0 bcd semiconductor manufacturing limited 12 mechanical dimensions (continued) to-252-2 (3) unit: mm(inch) 1.290.1 2.900ref 1 .400(0.05 5 ) 1 .700(0.06 7 ) 0.470(0.019) 0.600(0.024) 5 9 0 8 9.800(0.386) 10.400(0.409) 2.200(0.087) 2.380(0. 094) 0.900(0. 035) 1.100(0. 043) 4.700ref 6.500(0. 256) 6.700(0. 264) 5.130(0.202) 5.460(0.215) 0.150(0.006) 0.750(0.030) 6.000(0.236 ) 6.200(0.244 ) 0.720(0.028) 0.850(0.033) 2.286(0. 090) bsc 0.720(0.028) 0.900(0. 035) 0.900(0.035) 1.250(0.049) 1.800ref 8 0 0.600(0. 0 24) 1.000(0.039) 7 3 9 5 5.250ref option 1 option 2
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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